The performance of FR-4 material in high temperature and high humidity environments is as follows:
-In terms of mechanical properties: Although FR-4 material has high mechanical strength at room temperature and medium temperature, its mechanical properties may decrease in high temperature and high humidity environments, and problems such as deformation and cracking may occur, affecting its reliability as a structural support. However, reinforcement and other treatments can alleviate this to a certain extent
-In terms of electrical performance, high humidity environments can enhance the moisture absorption of FR-4 materials, leading to a decrease in insulation resistance and a change in dielectric constant, which in turn affects the quality of signal transmission, resulting in increased signal attenuation and slower transmission speed. But its electrical performance is relatively stable at high temperatures, but under extreme high temperatures and high humidity conditions, the stability of electrical performance will also deteriorate
-In terms of flame retardant performance: FR-4 material itself has good flame retardant performance, but in special high temperature and high humidity environments, the flame retardant performance will decrease, increasing the risk of circuit board fire. Corresponding fire prevention measures need to be taken, such as coating with fireproof coatings
-In terms of dimensional stability: High temperature and high humidity environments can affect the dimensional stability of FR-4 materials, increase the coefficient of thermal expansion, cause changes in the size of the circuit board, affect the stability of solder joints and connection parts of electronic components, and ultimately lead to circuit failures
