Mold heat insulation board, also known as high temperature mold heat insulation board, is a part of the engineer design mold must be considered. For this reason, engineers in the selection of mold heat insulation board, then must consider the characteristics of mold heat insulation board.
The following from the mold heat insulation board thermal stability, mold heat insulation board thermal conductivity, as well as mold heat insulation board water absorption rate and other aspects of how to generalize the characteristics of the identification of mold heat insulation board.
I. Mold heat insulation board for the first time
Mold heat insulation board, also known as high temperature mold heat insulation board. The material of mold heat insulation board is synthesized by glass fiber material and high heat-resistant composite material, and does not contain asbestos which is harmful to human body.
II. Characteristics of Mold Heat Insulation Board
In addition to not containing harmful asbestos, mold heat insulation board also has high mechanical and dielectric function, good heat resistance and moisture resistance, good processability. Low thermal conductivity, high temperature resistance up to 250 degrees, high flatness, excellent bending strength at high temperatures and other characteristics.
But how can we better identify the characteristics of mold insulation board? Below, let’s take stock.
III. Mold insulation board characteristics of the identification method
As mentioned above, there are many characteristics of mold insulation board, cost-effective. However, how to better identify the characteristics of the mold insulation board? Existing 6 strokes, can easily identify the mold insulation board has good characteristics.
(1) The first move: look at the mold thermal insulation board thermal stability
High temperatures will allow the organic components within the thermal insulation material oxidative degradation. Therefore, high-quality heat insulation board material needs to withstand the long repeated high temperature and pressure test, continuous resistance to the thermal stress and mechanical stress within the system, in general, high-quality mold heat insulation board material generally have 3-5 years of uniform life.
(2) the second move: look at the mold thermal insulation board thermal conductivity
This is a mold insulation board material zui important technical parameters, it represents the thermal insulation material insulation effect. The lower the coefficient of thermal conductivity, the better the thermal insulation function of the material.
(3) the third move: see mold heat insulation board in the long-term high temperature and high pressure environment is not deformed
Most of the main components of the thermal insulation materials for organic polymers. Compared with inorganic materials, organic materials are generally better resistance, not easy to crack when subjected to thermal stress. However, in a high-temperature environment, the thermal stability of organic materials will be degraded with time, that is to say, although the organic materials will not occur instantaneous softening, fracture and melting, but its life expectancy will be reduced with the increase in temperature, and therefore, the data in the acceptance of the effect of thermal stress over a long period of time under the scale stability of the selection of the heat insulation board is an important reference target. Generally speaking, good thermal stability of the material, after accepting 5000 hours of high temperature, deformation is less than 1%.
(4) the fourth move: look at the mold heat insulation board in zui high application temperature compressive strength
In general, the compressive strength of the heat insulation board material is measured at room temperature. Following the temperature rise, the compressive strength of the material will drop sharply. When selecting insulation board materials, engineers need to refer to the compressive strength at a set application temperature. For example, an organic material zui high application temperature of 350 degrees, if it is at room temperature compressive strength of 300MPa, it will drop to 350 degrees compressive strength of 100MPa below. On the contrary, if an inorganic material zui high application temperature of 1500 degrees, then, it is in the room temperature text 1500 degrees when the compressive strength is equal, the difference can be ignored.
In the selection of mold insulation materials, mold engineers need to be based on their own process requirements, such as temperature and pressure, to select their own needs of cost-effective zui good insulation board.
(5) The fifth move: look at the mold heat insulation board water absorption rate
Water absorption will bring negative impact to the function of the mold insulation board material, there are two main reasons: First, the temperature is higher than 100 degrees, the water content of the material occurs higher vapor pressure, the formation of the material crack, this phenomenon in the water content of more than 10 of the material is very common; Second, the water absorption rate affects the material’s thermal insulation function.
The dry material and the wet material compared to have a lower thermal conductivity. In the cooling phase of the system, the water absorption phenomenon of the material will form the system again when warming up, water evaporation consumes additional heat.
(6) The sixth move: look at the mold insulation board tolerances
Fiber reinforced material, on the scale of stability is far better than metal materials. Of course, the mold insulation board material is not possible to adhere to absolutely no deformation, therefore, engineers select the insulation board, the tolerance has strict requirements. Here must emphasize, in most cases, the use of heat insulation board temperature is much higher than room temperature. Mold heat insulation plate material deformation is not formed by thermal expansion, but because of drying, curing or oxidation of the material to form
